Thermogravimetric Analysis (TGA) measures weight changes in a material as a function of temperature (or time) under a controlled atmosphere. Its principal uses include measurement of a material’s thermal stability and composition.
Thermogravimetric Analysis instruments are routinely used in all phases of research, quality control and production operations.
SEIKO SSC/5200 TG/DTA 220 Thermal Analysis Station
TGA operating parameters: ceramic pans, ~ 50mg
Working gas: Argon
Temperature program: 300 to 10000C at 100C/min.
Thermogravimetric analysis was performed on the two grout samples from Drums 2 & 4. An overlay of the TGA profiles for both samples is provided as shown below . Drum 2 shows a total mass loss of < 1% by weight. The TGA profile of Drum 4 shows a significant mass loss of 28% occurring between ~1380C to ~9200 C
Differentiating between Non-shrink (N-S) Epoxy grout (Drum 2) and N-S Cementitious grout (Drum 4)